描述
A flaw has been found in Creality Cloud App up to 6.1.0 on Android. Affected by this vulnerability is an unknown functionality of the file AndroidManifest.xml of the component com.cxsw.sdprinter. Executing manipulation can lead to improper export of android application components. It is possible to launch the attack on the local host. The exploit has been published and may be used. The vendor was contacted early about this disclosure but did not respond in any way.